Looking at the final external form, there are now countless packaging methods, which is really too many, such as QFP, QFN, SOT, DIP, BGA, etc. So today we will not introduce in this way. Instead, we will introduce according to the development history of packaging, classified by packaging process.
1st Generation Packaging: wire bond (commonly known as wire bonding)
This packaging method appeared earliest, and although it is first-generation technology, many chips still use this method for packaging today, because the technology is mature and the cost is low. The final packaged appearance looks like this.
Let's talk about this packaging process first
- Cutting
In the packaging factory...
2nd Generation Packaging: Surface Mount Technology (SMT)
3rd Generation Packaging: Area Array Packages (BGA, CSP)
4th Generation Packaging: Advanced Packaging (3D, SiP)
