According to the announcement, Gaosbell recently received the "Notice on the Review and Evaluation Results of the 2019 Industrial Strong Foundation Project Implementation Plan (First Batch)" from the General Office of the Ministry of Industry and Information Technology. The company's project on high-frequency microwave, high-density packaging copper clad laminates for electronic circuits has successfully passed the acceptance evaluation.
This marks a major breakthrough in China's PCB industry, breaking the long-standing monopoly of European and American companies in this field and achieving domestic production of high-end copper clad laminates. This technology breakthrough is of great significance for improving China's PCB industry chain and enhancing the competitiveness of domestic electronic products.
