Advanced packaging is playing an increasingly important role in the development of new system-level chips, and is becoming a more viable solution. However, for chip manufacturers, the range of choices it offers is sometimes confusing, and sometimes expensive.
The $42 billion opportunity in advanced IC packaging:
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Market size: The advanced packaging market is expected to reach $42 billion by 2025.
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Technology trends: 3D packaging, SiP, fan-out packaging and other technologies continue to develop.
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Application drivers: AI, 5G, automotive electronics and other applications drive the demand for advanced packaging.
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Key technologies:
- 2.5D/3D packaging: Vertical stacking of multiple chips to improve integration.
- Fan-out packaging: Achieving higher I/O density without substrates.
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SiP: Integrating multiple chips and passive components in one package.
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Challenges: High cost, complex process, yield improvement and other issues still need to be solved.
How to seize this $42 billion opportunity? Chip manufacturers need to: - Choose packaging technologies that suit their products - Establish partnerships with packaging and testing companies - Invest in R&D to master core technologies - Optimize costs to improve competitiveness
