Packaging refers to connecting the circuit pins on the silicon chip to external pins using wires, so that they can be connected to other devices. The package form refers to the shell used to install semiconductor integrated circuits. It not only serves to install, fix, seal, protect the chip, and enhance electrical and thermal performance, but also serves as a bridge between the chip and the external circuit.
The development of packaging technology has gone through several stages:
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Early packaging: Such as DIP (Dual In-line Package), mainly using through-hole mounting technology.
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Surface mount packaging: Such as SOP, QFP, etc., improving assembly density and production efficiency.
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Area array packaging: Such as BGA, CSP, etc., further improving pin count and electrical performance.
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Advanced packaging: Such as 3D packaging, SiP (System in Package), achieving higher integration and performance.
Modern packaging technology is developing towards higher density, smaller size, better heat dissipation, and lower cost.
